Semiconductor devices and methods of fabricating the same

ABSTRACT

A method of fabricating a semiconductor memory device includes forming a mold stack on a substrate and the mold stack including first sacrificial layers and second sacrificial layers alternately stacked on the substrate. The method also includes forming a plurality of vertical channels that penetrate the mold stack and that contact the substrate, patterning the mold stack to form word line cuts between the vertical channels, the word line cuts exposing the substrate, removing one of the first and second sacrificial layers to form recessed regions in the mold stack, forming a data storage layer, at least a portion of the data storage layer being formed between the vertical channels and the gates, forming gates in the recessed regions, forming air gaps between the gates by removing the other of the first and second sacrificial layers, and forming an insulation layer pattern in the word line cuts.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a divisional application based on pending application Ser. No.13/214,462, filed Aug. 22, 2011, the entire contents of which is herebyincorporated by reference.

This U.S. non-provisional patent application claims priority under 35U.S.C. §119 to Korean Patent Application No. 10-2010-0084222, entitled“Semiconductor Devices and Methods of Fabricating the Same,” filed onAug. 30, 2010, the entirety of which is incorporated by referenceherein.

BACKGROUND

Semiconductor devices are becoming more highly integrated to meet therequirements of customers, e.g., in order to provide high performanceand low cost. The integration density of the semiconductor devices is afactor that may directly influence the cost of the semiconductordevices. Thus, the semiconductor devices have been continuously scaleddown.

SUMMARY

Embodiments may be realized by providing a method of fabricating asemiconductor memory device that includes forming a mold stack on asubstrate, the mold stack including first sacrificial layers and secondsacrificial layers alternately stacked on the substrate. The methodincludes forming a plurality of vertical channels that penetrate themold stack and that contact the substrate, patterning the mold stack toform word line cuts between the vertical channels, the word line cutsexposing the substrate, removing one of the first and second sacrificiallayers to form recessed regions in the mold stack, forming a datastorage layer, at least a portion of the data storage layer being formedbetween the vertical channels and the gates, forming gates in therecessed regions, forming air gaps between the gates by removing theother of the first and second sacrificial layers, and forming aninsulation layer in the word line cuts.

The first sacrificial layers may be formed of silicon germanium layersand the second sacrificial layers may be formed of silicon nitridelayers.

The recessed regions may be formed by removing the second sacrificiallayers using a first etchant supplied through the word line cuts, andthe gates may be formed by filling the recessed regions with aconductive material. The air gaps may be formed by removing the firstsacrificial layers using a second etchant supplied through the word linecuts.

Forming the data storage layer may include sequentially forming atunneling insulation layer, a trapping insulation layer, and a blockinginsulation layer in the recessed regions before forming the gatestherein or on sidewalls of vertical channel holes before forming thevertical channels therein. Forming the data storage layer may includeforming a tunneling insulation layer on sidewalls of vertical channelholes before forming the vertical channels therein, forming a blockinginsulation layer in the recessed regions before forming the gatestherein, and forming a trapping insulation layer. The trappinginsulation layer may be formed on the tunneling insulation layer afterforming the tunneling insulation layer on the sidewalls of the verticalchannel holes or may be formed in the recessed regions before formingthe blocking insulation layer in the recessed regions.

Forming the insulation layer may include depositing an insulatingmaterial with a physical vapor deposition technique to contact thesubstrate. The method may include forming a plurality of verticalchannel holes that penetrate the mold stack and expose the substrate,and oxidizing the first sacrificial layers exposed by the verticalchannel holes to form a plurality of sacrificial oxide layers prior toforming the vertical channels in the vertical channel holes. The methodmay include forming a capping insulation layer on the mold stack.

Patterning the mold stack to form word line cuts may include patterningthe capping insulation layer, forming the insulation layer pattern mayinclude forming overhanging portions that overhang ends of the cappinglayer adjacent to the word line cuts, and the insulation layer may bespaced apart from the substrate and closing upper openings of the wordline cuts. The method may include forming a protection layer onsidewalls of the vertical channels exposed by the air gaps.

Embodiments may also be realized by providing a semiconductor memorydevice that includes a plurality of bit lines on a substrate and spacedapart from each other in a first direction, the bit lines extending in asecond direction that intersects the first direction, and a plurality ofword lines between the substrate and the bit lines, the word lines beingspaced apart from each other in the second direction and extending inthe first direction. The semiconductor memory device includes aplurality of vertical channels at intersections of the bit lines and theword lines, the vertical channels being substantially perpendicular to asurface of the substrate, and a plurality of data storage layers betweenthe word lines and the vertical channels. The word lines are spacedapart from each other along the vertical channels and are insulated fromeach other by air gaps.

The semiconductor memory device may include a protection layer coveringsidewalls of the vertical channels adjacent to the air gaps. Theprotection layer may include an oxide layer of a silicon germanium.

The semiconductor memory device may include a word line cut extending inthe first direction to expose the substrate and an insulation layercovering an upper portion of the word line cut to close the word linecut. The insulation layer may be in the word line cut, and having voidstherein, contacting the substrate or the insulation layer may partiallyfill the upper portion of the word line cut and may be spaced apart fromthe substrate.

Embodiments may also be realized by providing a method of fabricating asemiconductor memory device that includes forming a mold stack on asubstrate, the mold stack including first sacrificial layers and secondsacrificial layers alternately stacked on the substrate, forming aplurality of vertical channels that penetrate the mold stack, patterningthe mold stack to form word line cuts between the vertical channels, theword line cuts exposing the substrate, removing one of the first andsecond sacrificial layers to form recessed regions in the mold stack,filling a conductive material in the recessed regions, forming air gapsbetween the recessed regions filled with the conductive material byremoving the other of the first and second sacrificial layers, andforming an insulation layer in the word line cuts to close the word linecuts, at least a portion of the word line cuts between an uppermostlayer of the mold stack and the substrate being unfilled with theinsulation layer.

Filling the conductive material in the recessed regions may includeforming gates such that adjacent gates are spaced apart by one of theair gaps, the insulation layer, and a void in the word line cuts.Forming the insulation layer may include having the air gaps between theinsulation layer and the vertical channels. The insulation layer mayleave voids within the word line cuts. When closing the word line cuts,the insulation layer is spaced apart from the substrate to formedunfilled portions of the word line cuts and the air gaps are continuouswith unfilled portions of the word line cuts.

BRIEF DESCRIPTION OF THE DRAWINGS

Features will become apparent to those of ordinary skill in the art bydescribing in detail exemplary embodiments with reference to theattached drawings, in which:

FIGS. 1A and 1B illustrate a semiconductor device, according to anexemplary embodiment.

FIG. 1C illustrates a circuit diagram of a semiconductor device,according to an exemplary embodiment.

FIGS. 2A to 2F illustrate enlarged perspective views of portions of FIG.1A, according to exemplary embodiments.

FIGS. 3A to 3J illustrate vertical sectional views, taken along adirection parallel to a bit line, of stages in a method of fabricating asemiconductor device, according to an exemplary embodiment.

FIGS. 4A to 4C illustrate vertical sectional views, taken along adirection crossing bit lines in FIGS. 3C, 3H and 3J, respectively, ofstages in a method of fabricating a semiconductor device, according toan exemplary embodiment.

FIGS. 5A to 5F illustrate vertical sectional views of stages in a methodof fabricating a semiconductor device, according to an exemplaryembodiment.

FIGS. 6A to 6F illustrate vertical sectional views of stages in a methodof fabricating a semiconductor device, according to an exemplaryembodiment.

FIGS. 7A to 7D illustrate vertical sectional views of stages in a methodof fabricating a semiconductor device, according to an exemplaryembodiment.

FIGS. 8A to 8D illustrate vertical sectional views of stages in a methodof fabricating a semiconductor device, according to an exemplaryembodiment.

FIGS. 9A to 9D illustrate vertical sectional views of stages in a methodof fabricating a semiconductor device, according to an exemplaryembodiment.

FIGS. 10A to 10D illustrate vertical sectional views of stages in amethod of fabricating a semiconductor device, according to an exemplaryembodiment.

FIGS. 11A to 11C illustrate vertical sectional views of stages in amethod of fabricating a semiconductor device, according to an exemplaryembodiment.

FIGS. 12A to 12D illustrate vertical sectional views of stages in amethod of fabricating a semiconductor device, according to an exemplaryembodiment.

FIGS. 13A and 13B illustrate block diagrams of electronic productsincluding a semiconductor device according to any one of theembodiments.

DETAILED DESCRIPTION

Example embodiments will now be described more fully hereinafter withreference to the accompanying drawings; however, they may be embodied indifferent forms and should not be construed as limited to theembodiments set forth herein. Rather, these embodiments are provided sothat this disclosure will be thorough and complete, and will fullyconvey the scope of the invention to those skilled in the art.

The term “and/or” includes any and all combinations of one or more ofthe associated listed items. It will be understood that when an elementis referred to as being “connected” or “coupled” to another element, itmay be directly connected or coupled to the other element or interveningelements may be present. Similarly, it will be understood that when anelement such as a layer, region or substrate is referred to as being“on” another element, it can be directly on the other element orintervening elements may be present. In contrast, the term “directly”means that there are no intervening elements. It will be furtherunderstood that the terms “comprises”, “comprising,”, “includes” and/or“including”, when used herein, specify the presence of stated features,integers, steps, operations, elements, and/or components, but do notpreclude the presence or addition of one or more other features,integers, steps, operations, elements, components, and/or groupsthereof.

Embodiments in the detailed description will be described with sectionalviews as exemplary views of the embodiments. Accordingly, shapes of theexemplary views may be modified according to, e.g., manufacturingtechniques and/or allowable errors. Therefore, the embodiments are notlimited to the specific shapes illustrated in the exemplary views, butmay include other shapes that may be created according to manufacturingprocesses. Areas exemplified in the drawings have general properties,and are used to illustrate exemplary shapes of elements. Thus, thisshould not be construed as limited to the scope of the inventiveconcept.

It will be also understood that although the terms first, second, thirdetc. may be used herein to describe various elements, these elementsshould not be limited by these terms. These terms are only used todistinguish one element from another element. Thus, a first element insome embodiments could be termed a second element in other embodimentswithout departing from the teachings. Exemplary embodiments explainedand illustrated herein include their complementary counterparts. Likereference numerals refer to like elements throughout the specification.

DEVICE EXEMPLARY EMBODIMENTS

FIGS. 1A and 1B are perspective views illustrating a semiconductordevice according to an exemplary embodiment. FIG. 1C is an equivalentcircuit diagram illustrating a semiconductor device according to anexemplary embodiment.

Referring to FIGS. 1A and 1B, a semiconductor memory device 1 mayinclude a plurality of vertical channels 140, a plurality of gates 165and a plurality of bit lines 145 which are disposed on a substrate 101.The vertical channels 140 may extend in a vertical direction, e.g., thez-axis direction, and may be substantially perpendicular to thesubstrate 101. The gates 165 may extend in a first horizontal direction,e.g., the x-axis direction. The gates 165 may include, e.g., word linesas referred to “WL” in FIG. 1C and selection lines as referred to “GSL”and “SSL” in FIG. 1C. The GSL may be a ground select line. The SSL maybe a string select line. The gates 165 may be stacked along an extendingdirection, e.g., the z-axis direction, of the vertical channels 140. Thebit lines 145 may be electrically connected to the vertical channels140. The bit lines 145 may extend in a second horizontal direction,e.g., the y-axis direction.

Each of the vertical channels 140 may have a lower portion connected tothe substrate 101 and an upper portion connected to one of the bit lines145. The substrate 101 may include a semiconductor substrate such as asilicon wafer. The gates 165 may include a ground selection gate 165 gadjacent to the substrate 101. The gates 165 may include a stringselection gate 165 s adjacent to the bit lines 145. A plurality ofmemory gates 165 w may be disposed between the ground selection gate 165g and the string selection gate 165 s, e.g., along an extendingdirection of each vertical channel 140. The ground selection gate 165 gmay constitute a ground selection line, e.g., refer to “GSL” in FIG. 1C.Each of the string selection gates 165 s may constitute a stringselection line, e.g., refer to “SSL” in FIG. 1C.

Each of the memory gates 165 w may constitute a word line, e.g., referto “WL” in FIG. 1C. A predetermined one of the plurality of verticalchannels 140, as well as the word lines WL and the selection lines GSLand SSL adjacent to the predetermined vertical channel 140, mayconstitute a single cell string, e.g., refer to single cell string 105in FIG. 1C. The word lines WL, e.g., all of the word lines WL, may actas main memory gates controlling corresponding memory cells of all ofthe memory cells. At least one word line WL immediately adjacent to theselection line GSL and/or SSL may act as a dummy memory gate of a dummycell. As described above, the semiconductor device 1 may correspond to aflash memory device including a plurality of memory cells that arearranged in a three dimensional array.

The semiconductor memory device 1 may include a plurality of contacts180. The contacts 180 may connect the selection lines GSL and SSL andthe word lines WL to driving circuits. The contacts 180 may have a plugshape, e.g., may have a shape like a vertical pillar. At least one ofthe contacts 180 may have a lower portion electrically connected to oneof the gates 165, e.g., may contact one of the memory gates 165 w. Atleast one contact 180 may contact the string selection gate 165 s, andat least one contact 180 may contact the ground selection gate 165 g. Atleast one of the contacts 180 may have an upper portion electricallyconnected to a metal line, e.g., one of metal lines 184 and 194. Themetal lines 184 and 194 may be electrically connected to the drivingcircuits. The metal lines 184 and 194 may extend in a direction thatintersects the extending direction of the contacts 180.

In an exemplary embodiment, the contacts 180 may be electricallyconnected to one of the metal lines 184 and 194 through pads 181. Themetal lines may be first metal lines 194 and second metal lines 184. Thefirst metal lines 194 may electrically connect the string selectionlines SSL to a string selection line driving circuit. The second metallines 184 may electrically connect the ground selection lines GSL andthe word lines WL to a ground selection line driving circuit and a wordline driving circuit, respectively.

Intermediate metal lines 182 and 192 may be disposed between thecontacts 180 and the metal lines 184 and 194. The intermediate metallines may include first intermediate metal lines 192 electricallyconnected to the first metal lines 194. The intermediate metal lines mayinclude second intermediate metal lines 182 electrically connected tothe second metal lines 184. For example, the first intermediate metallines 192 may be electrically connected to the first metal lines 194through pads 193, and the second intermediate metal lines 182 may beelectrically connected to the second metal lines 184 through pads 183.

According to an exemplary embodiment, one of the ground selection gate165 g and the string selection gate 165 s may have a line-shapedconfiguration, and the other may have a plate-shaped configuration. Forexample, in the line-shaped configuration the gates may include aplurality of rectangular shaped lines arranged parallel to each other,e.g., the rectangular shaped lines may be spaced apart to form aplurality of gates. In the plate-shaped configuration the plurality ofgates may be formed from a single continuous plate. Alternatively, theground selection gate 165 g and the string selection gate 165 s may havea line-shaped configuration, e.g., as illustrated in FIG. 1B. The memorygates 165 w may have a line-shaped configuration or a plate-shapedconfiguration. For example, each of the string selection gates 165 s mayhave a line-shaped configuration, and each of the memory gates 165 w andthe ground selection gate 165 g may have a rectangular-shaped plateconfiguration that includes word line slots 132 therein. The word lineslots 132 may also be referred to as word line cuts 132 inspecification.

The gates 165 may be stacked to have a pyramid structure. That is, eachof the gates 165 may have an edge, e.g., a pad 167, that does notoverlap with another gate 165 immediately stacked thereon. For example aperiphery of the lowest gate 165 may not overlap a peripheral edge ofthe gate 165 above the lowest gate 165. The uppermost gate 165 may havethe smallest perimeter such that the perimeters of the gates 165gradually decrease from the lowest gate 165 to the uppermost gate 165.The pads 167 of the gates 165 may be exposed when viewed from a top planview, e.g., as illustrated in FIG. 1B. The pads 167 of the gates 165 mayprovide areas to which corresponding contacts 180 are connected.

Without intending to be bound by this theory, a parasitic capacitor mayexist between the pair of adjacent gates 165 that are arranged such thatpairs of adjacent gates 165 overlap, e.g., completely overlap, with eachother. In this regard, the more a distance between the adjacent gates165 is reduced, the more a parasitic capacitance of the parasiticcapacitor may be increased. The increase of the parasitic capacitancemay lead to, e.g., an increase of an RC delay time that influences anoperating speed of the semiconductor memory device 1.

The gates 165 may be electrically isolated, e.g., from adjacent gates165, by filling spaces between the gates 165 with an insulator such as asilicon oxide layer. For example, the silicon oxide layer may have adielectric constant of about 3.9. In the event that the dielectricconstant of the insulator between the gates 165 decreases, atransmission speed of electrical signals may be improved. Thus, thespaces between the gates 165 may be filled with an insulator having alower dielectric constant than the silicon oxide layer in order to,e.g., improve the operating speed of the semiconductor memory device 1.In an embodiment, the spaces between the gates 165 may be filled withair or vacuum having a dielectric constant of about 1.0. That is, thegates 165 may be spaced apart from each other to provide air gaps 116between the gates 165. As a result, the parasitic capacitance and/orloading capacitance between the gates 165 may be reduced, e.g.,significantly reduced.

Referring to FIGS. 1A, 1B, and 1C, memory cells 28 may be defined atintersections of the memory gates 165 w, e.g., constituting the wordlines WL, and the vertical channels 140. Upper non-memory cells 26 maybe defined at intersections of the string selection gates 165 s, e.g.,constituting the string selection lines SSL, and the vertical channels140. Lower non-memory cells 24 may be defined at intersections of theground selection gates 165 g, e.g., constituting the ground selectionline GSL, and the vertical channels 140.

Source regions may be disposed in the semiconductor substrate 101, e.g.,the source regions may constitute a common source line CSL asillustrated in FIG. 1C. One upper non-memory cell 26, one lowernon-memory cell 24, and the memory cells 28 between the one uppernon-memory cell 26 and the one lower non-memory cell 24 may constitute acell string 105. The memory device 1 may include a plurality of cellstrings 105, and each cell string 105 may be disposed along each of thevertical channels 140. Each of the cell strings 105 may be electricallyconnected to one of the bit lines BL. Each of the bit lines BL may beelectrically connected to more than one cell string 105, e.g., to aplurality of cell strings 105 arranged adjacent to each other along afirst direction. That is, the plurality of cell strings 105 may beconnected in parallel to one of the bit lines BL. The equivalent circuitdiagram of FIG. 1C may be applicable to all of the semiconductor memorydevices disclosed throughout the specification.

According to an exemplary embodiment, each of the word lines WL may havea planar structure and may be substantially perpendicular to the cellstrings 105. The word lines WL may be stacked in, e.g., a z-direction.The memory cells 28 may be arranged in a two dimensional array in eachof the word lines WL. The word lines WL may be arranged in an x-y planesuch that the word lines may be parallel to each other in x-y planes,e.g., the word lines WL may be stacking in parallel x-y planes. As aresult, the memory cells 28 may be arranged in a three dimensional arraywith the plurality of planar word lines WL which are sequentiallystacked. The string selection lines SSL may be disposed to cross the bitlines BL and to extend in the X-axis direction. The string selectionlines SSL cross the bit lines BL, and the string selection lines SSL arerespectively connected to the cell strings 105. Thus, if one of thestring selection lines SSL and one of the bit lines BL are selected, oneof the cell strings 105 may be independently selected. The groundselection line GSL may have a planar structure and may be substantiallyperpendicular to the cell strings 105. The ground selection line GSL maycontrol the electrical connection between the substrate 101 and thevertical channels 140. That is, the ground selection line GSL maycontrol the electrical connection between the substrate 101 and the cellstrings 105.

In an embodiment, a program operation of the semiconductor memory device1 may be achieved by, e.g., inducing a voltage difference between aselected word line WL and a selected vertical channel 140 to injectelectrical charges into data storage layer, e.g., data storage layer to155 of FIG. 2A. For example, if a positive program voltage is applied tothe selected word line WL, electrons in the selected vertical channel140 may be injected into the data storage layer of a selected memorycell disposed at the intersection of the selected word line WL and theselected vertical channel 140 by, e.g., the Fowler-Nordheim tunnelingeffect. As a result, the program operation may be successively realized.A boosting technique may be applied to non-selected memory cellsconnected to the selected word line WL to reduce the possibility ofand/or prevent the non-selected memory cells from being programmedduring the program operation. The explanations of the data storage layerwill be described with reference to FIGS. 2A to 2F.

A read operation may include, e.g., applying a ground voltage to aselected word line WL connected to a selected memory cell 28 to be readout and applying a read voltage to non-selected word lines WL. The readvoltage may be determined to turn on the memory cells connected to thenon-selected word lines WL. For example, a current flowing through a bitline BL connected to a selected cell string 105 including the selectedmemory cell 28 may be decided depending on whether a threshold voltageof the selected memory cell 28 is higher or lower than the groundvoltage. For example, if the threshold voltage of the selected memorycell 28 is lower than the ground voltage, the current flowing throughthe bit line connected to the selected cell string 105 may be chargedup. Otherwise, the bit line current may not be charged up. Accordingly,data information stored in the selected memory cell 28 may bediscriminated by detecting the bit line current of the selected memorycell 28.

An erase operation may be performed, e.g., using a gate induced drainleakage (GIDL) current by the memory block. In an embodiment, anelectrical potential of a selected vertical channel 140 may be boostedby applying an erasure voltage to a selected bit line BL and thesubstrate 101. The erasure voltage may be, e.g., a positive voltage. Thepotential of the selected vertical channel 140 may rise up after apredetermined delay time. When a low voltage, e.g., a ground voltage, isapplied to the ground selection gate 165 g corresponding to the groundselection line, the gate induced drain leakage (GIDL) effect may occurat a junction region between a source region adjacent to the groundselection gate 165 g and the selected vertical channel 140. Thus,electrons generated at the junction region may be injected into thesubstrate 101, and holes generated at the junction region may beinjected into the selected vertical channel 140. As a result, anelectrical potential corresponding to the erasure voltage may betransmitted to the selected vertical channel 140. In this case, if aground voltage is applied to the word lines WL adjacent to the selectedvertical channel 140, electrons in the data storage layers of the memorycells formed at the selected vertical channel 140 may be ejected. Thus,all of the memory cells formed at the selected vertical channel 140 maybe simultaneously erased. Non-selected memory cells in non-selectedmemory blocks may not be erased by electrically floating the word linesconnected to the non-selected memory blocks during the erase operation.

The operation methods described above correspond to exemplaryembodiments. That is, the operation methods may be embodied in differentforms and should not be construed as limited to the embodiments setforth herein.

<Examples of the Data Storage Layer>

FIGS. 2A to 2F are enlarged perspective views illustrating a portion ofFIG. 1A.

Referring to FIG. 2A, a data storage layer 155 may surrounds each of thegates 165. The data storage layer 155 may include, e.g., a tunnelinginsulation layer 151, a blocking insulation layer 153, and a trappinginsulation layer 152 between the tunnel insulation layer 151 and theblocking insulation layer 153. The blocking insulation layer 153, thetrapping insulation layer 152, and the tunneling insulation layer 151may be sequentially stacked. The tunneling insulation layer 151 maycontact the vertical channel 140 and may extend to cover top and bottomsurfaces of the respective gates 165. The blocking insulation layer 153may contact a sidewall, a top surface, and a bottom surface of therespective gates 165.

The tunneling insulation layer 151 may include, e.g., at least one of asilicon oxide layer and a silicon nitride layer. The trapping insulationlayer 152 may include, e.g., a silicon nitride layer. The blockinginsulation layer 153 may include, e.g., at least one of a silicon oxidelayer and an aluminum oxide layer. In another exemplary embodiment, thetrapping insulation layer 152 may be replaced with a floating gate.

Each of the gates 165 may surrounds the vertical channel 140, and thedata storage layer 155 may be disposed between the gate 165 and thevertical channel 140. The gate 165 and the vertical channel 140surrounded by the gate 165 may constitute a cell 20. The cell 20 maycorrespond to a memory cell, e.g., when the gate 165 is a memory gate165 w, as illustrate in FIG. 1A. Alternatively, the cell 20 maycorrespond to a non-memory cell when the gate 165 is a selection gate165 g or 165 s, as illustrate in FIG. 1A. A structure of the datastorage layer 155 may be modified in various forms, as described withreference to FIGS. 2B to 2F.

Referring to FIG. 2B, a protection layer 218 may be disposed betweendata storage layers 255 and surrounding gates 265. The protection layer218 may surround sidewalls of a vertical channel 240, which are exposedby air gaps 216, e.g., are exposed in areas between adjacent surroundinggates 265. Thus, the protection layer 218 may reduce the possibility ofand/or prevent the sidewalls of the vertical channel 240 from beingdamaged by, e.g., an etching process. This will be clearly understoodfrom FIG. 6E.

Referring to FIG. 2C, a data storage layer 355 may surround sidewalls ofa vertical channel 340. The data storage layer 355 may be are locatedbetween gates 365 and the vertical channel 340. The data storage layer355 may vertically extend to intervene between the vertical channel 340and the gates 365. In an exemplary embodiment, the data storage layer355 may include a tunneling insulation layer 351, a blocking insulationlayer 353, and a trapping insulation layer 352 between the tunnelinsulation layer 351 and the blocking insulation layer 353. Thetunneling insulation layer 351 may contact the vertical channel 340 andmay vertically extend to cover substantially entire sidewalls of thevertical channel 340, e.g., to entirely cover sides of the verticalchannel 340 in an area having the gates 365. The blocking insulationlayer 353 may contact the gates 365 and may vertically extend, e.g., tosubstantially cover the entire tunneling insulation layer 351.

The data storage layer 355 may be absent in the spaces 316, e.g., airgaps, between the gates 365. For example, the data storage layer 355 maynot extend horizontally to cover top and bottom surfaces of therespective gates 365. Thus, distances between the gates 365 may beminimized to lower an overall height of the semiconductor memory device.

Referring to FIG. 2D, the data storage layer 355 may be disposed betweenthe vertical channel 340 and the gates 365, and the data storage layer355 may include a first data storage layer 355 a and a second datastorage layer 355 b on the gates 365. The first data storage layer 355 amay vertically extend to cover the entire sidewalls of the verticalchannel 340, e.g., to entirely cover sidewalls of the vertical channel340 in an area having the gates 365. The second data storage layer 355 bmay horizontally extend to cover a top surface and a bottom surface ofeach of the gates 365. The first data storage layer 355 a may include,e.g., a tunneling insulation layer. The second data storage layer 355 bmay include, e.g., a blocking insulation layer. One of the first andsecond data storage layers 355 a and 355 b may include a trappinginsulation layer.

Referring to FIG. 2E, the data storage layer 355 may have substantiallythe same configuration and structure as described with reference to FIG.2C. In addition, a protection layer 318 may be disposed to cover outersidewalls of the data storage layer 355 between the gates 365. That is,the protection layer 318 may cover the outer sidewalls of the datastorage layer 355, which are exposed by the air gaps 316 between thegates 365. The protection layer 318 may reduce the possibility of and/orprevent the vertical channel 340 and the data storage layer 355 frombeing damaged by an etching process.

Referring to FIG. 2F, the data storage layer 355 may have substantiallythe same configuration and structure as described with reference to FIG.2D. In addition, the protection layer 318 illustrated in FIG. 2E may bedisposed to cover outer sidewalls of the first data storage layer 355 abetween the gates 365. That is, the protection layer 318 may cover theouter sidewalls of the first data storage layer 355 a, which are exposedby the air gaps 316 between the gates 365. The protection layer 318 mayreduce the possibility of and/or prevent the vertical channel 340 andthe first data storage layer 355 a from being damaged by an etchingprocess.

First Exemplary Method Embodiment

FIGS. 3A to 3J are vertical sectional views taken along a paralleldirection to a bit line to illustrate stages in an exemplary method offabricating a semiconductor device. FIGS. 4A, 4B, and 4C are verticalsectional views taken along a direction crossing bit lines in FIGS. 3C,3H and 3J, respectively, to illustrate stages in an exemplary method offabricating a semiconductor device.

Referring to FIG. 3A, first sacrificial layers 111-115 and secondsacrificial layers 121-124 may be alternately deposited on a substrate101 to form a mold stack 103. However, embodiments are not limitedthereto, e.g., the mold stack may include additional first and secondsacrificial layers. The substrate 101 may include a semiconductorsubstrate such as a silicon wafer or a substrate having an insulationlayer. The mold stack 103 may include a first sacrificial layer group110 and a second sacrificial layer group 120. The first sacrificiallayer group 110 may be composed of the first sacrificial layers 111,112, 113, 114 and 115. The second sacrificial layer group 120 may becomposed of the second sacrificial layers 121, 122, 123 and 124.

In an embodiment, a bottommost layer and a topmost layer of the moldstack 103 may be the first sacrificial layer 111 and the firstsacrificial layer 115, respectively. The number of the first sacrificiallayers 111-115 may be optional, and the number of the second sacrificiallayers 121-124 may also be optional. In the following embodiment, thenumber of the first sacrificial layers 111-115 is 5 and the number ofthe second sacrificial layers 121-124 is 4, as illustrated in FIG. 3A.However, embodiments are not limited to the following exemplaryembodiment, and may be implemented in various forms.

The first sacrificial layers 111-115 may be formed of a material layerhaving a relatively high wet etching selectivity with respect to thesecond sacrificial layers 121-124 to selectively remove one of the firstsacrificial layer group 110 and the second sacrificial layer group 120,as subsequently described with reference to FIGS. 3D and 3I. The firstsacrificial layers 111-115 may be composed of a material layer having arelatively low dry etching selectivity or no dry etching selectivitywith respect to the second sacrificial layers 121-124 in order to formvertical channel holes 130 and word line cuts 132 with a simple etchingrecipe, as subsequently described with reference to FIGS. 3B and 3C. Forexample, each of the first sacrificial layers 111-115 may be formed bydepositing at least one of a silicon oxide (SiO₂) layer, a siliconnitride (SiN or Si₃N₄) layer, a silicon oxynitride (SiON) layer, asilicon carbide (SiC) layer, and a silicon-germanium (SiGe) layer. Thesecond sacrificial layers 121-124 may be formed by depositing at leastone of a silicon oxide (SiO₂) layer, a silicon nitride (SiN) layer, asilicon oxynitride (SiON) layer, a silicon carbide (SiC) layer, and asilicon-germanium (SiGe) layer, but the second sacrificial layers121-124 may be formed of a different layer than that used to form thefirst sacrificial layer 111-115. In an embodiment, the first sacrificiallayers 111-115 may be formed of a silicon germanium (SiGe) layer, andthe second sacrificial layers 121-124 may be formed of a silicon nitride(SiN or Si₃N₄) layer or a silicon oxynitride (SiON) layer.

Referring to FIG. 3B, a plurality of vertical channels 140 may be formedto penetrate the mold stack 103. The vertical channels 140 may be incontact with the substrate 101. According to an exemplary embodiment, aplurality of vertical channel holes 130 penetrating the first and secondsacrificial layer groups 110 and 120 may be formed using a dry etchingtechnique or a laser drilling technique. The vertical channels 140 maybe formed by filling the vertical channel holes 130 with, e.g., asemiconductor material.

The vertical channels 140 may be formed of at least one of a polysiliconlayer, a single crystalline silicon layer, and an amorphous siliconlayer. The vertical channels 140 may be formed by using a physical vapordeposition (PVD) technique, a chemical vapor deposition (CVD) technique,or an epitaxial growth technique. Each of the vertical channels 140 maybe formed to have a bulk configuration such as a pillar having acircle-shaped horizontal sectional view or a pillar having apolygon-shaped horizontal sectional view. Alternatively, each of thevertical channels 140 may be formed to include a macaroni-shaped siliconstructure and a bar-shaped insulator filling an inner space of themacaroni-shaped silicon structure.

Referring to FIG. 3C, the mold stack 103 may be patterned to form wordline cuts 132. An area of the first sacrificial layers 111-115 and thesecond sacrificial layers 121-124 between the vertical channels 140 maybe removed using a dry etching technique to form the word line cuts 132.The word line cuts 132 may expose the substrate 101 or the bottommostfirst sacrificial layer 111. The word line cuts 132 may expose sidewallsof the first and second sacrificial layers 111-115 and 121-124. The wordline cuts 132 may be formed to have a trench shape extending in thex-axis, e.g., extending in the same direction as the word line 165 w asillustrated in FIG. 1B.

Before or after formation of the word line cuts 132, the mold stack 103may be patterned to have a step shape at edges thereof, e.g., asillustrated in FIG. 4A. That is, the mold stack 103 may be patterned tohave a pyramid structure, before or after formation of the word linecuts 132. For example, the mold stack 103 may be patterned using anexposure process for shrink or expansion of a photo mask and a dryetching process, thereby forming a mold stack 103 having stepped edges.That is, the stepped mold stack 103 may be formed so that the length ofthe first and second sacrificial layers 111-115 and 121-124 in thex-axis direction or in x-axis and y-axis directions is gradually reducedfor first and second sacrificial layers 111-115 and 121-124 positionedfurther away from the substrate 101. For example, the topmost firstsacrificial layer 115 and the topmost second sacrificial layer 124 maybe patterned to form a first step, and the first sacrificial layer 114and the second sacrificial layer 123 under the first step may bepatterned to form a second step.

After formation of the mold stack 103 having the stepped edge, aninsulation layer 170 may be additionally formed on the substrate 101having the stepped mold stack 103. The insulation layer 170 may beformed of, e.g., a silicon oxide layer. The word line cuts 132 may beformed before or after formation of the insulation layer 170. The wordline cuts 132 may have a length in the x-axis direction which is greaterthan a length in the X-axis direction of the patterned topmost firstsacrificial layer 115 and is less than a length in the x-axis directionof the patterned first sacrificial layer 114 under the patterned topmostfirst sacrificial layer 115 (see FIG. 4A). As a result, each of thetopmost first sacrificial layer 115 and the topmost second sacrificiallayer 124 may be divided into a plurality of sub-patterns, which areseparated from each other, by the word line cuts 132. The sub-patternsmay be arrayed in the y-axis direction because the word line cuts 132may be formed to extend in the x-axis direction. According to anotherembodiment, each of the first sacrificial layers 111-114 and the secondsacrificial layers 121-123 may be formed to have a plate shape with theword line cuts 132 therein.

Referring to FIG. 3D, the second sacrificial layer group 120 may beselectively removed to form a plurality of recessed regions 126, e.g., aplurality of undercuts between the first sacrificial layers 111-114 ofthe first sacrificial group 110. In an exemplary embodiment, when thesecond sacrificial layers 121-124 are formed of a silicon nitride layer,the second sacrificial layers 121-124 may be removed by supplying a wetetchant such as a phosphoric acid (H₃PO₄) solution through the word linecuts 132. As a result, the first sacrificial layers 111-115 may exist tobe vertically spaced apart from each other along the vertical channels140, and sidewalls of the vertical channels 140 may be exposed by therecessed regions 126.

Referring to FIG. 3E, an insulation layer stack 150 may be formed on thesubstrate 101 having the mold stack 103 and the recessed regions 126.The insulation layer stack 150 may be formed using a technique, e.g., achemical vapor deposition (CVD) technique or an atomic layer deposition(ALD) technique, which exhibits an excellent step coveragecharacteristic. Thus, the insulation layer stack 150 may be formed toconformably cover insides of the recessed regions 126. The insulationlayer stack 150 may be formed to have a multi-layered structure, asillustrated in FIG. 2A. For example, the insulation layer stack 150 maybe formed to include a tunneling insulation layer 151, a trappinginsulation layer 152, and a blocking insulation layer 153. The tunnelinginsulation layer 151 may be formed by depositing, e.g., a silicon oxidelayer, and trapping insulation layer 152 may be formed by depositing,e.g., a silicon nitride layer on the tunneling insulation layer 151. Theblocking insulation layer 153 may be formed by depositing, e.g., asilicon oxide layer or an aluminum oxide layer, on the trappinginsulation layer 152. The insulation layer stack 150 may be formed tosurround sidewalls of the first sacrificial layers 111-115 and to coverthe substrate 101 which is exposed by the word line cuts 132

Referring to FIG. 3F, a conductive layer 160 may be formed on theinsulation layer stack 150. The conductive layer 160 may be formed tofill the word line cuts 132 and the recessed regions 126. The conductivelayer 160 may be formed of, e.g., at least one of a doped silicon layer,a tungsten layer, a metal nitride layer, or a metal silicide layer. Theconductive layer 160 may be formed by using a chemical vapor depositiontechnique. In an embodiment, the conductive layer 160 may be formed of atungsten layer, a titanium nitride layer, or a combination layerthereof.

Referring to FIG. 3G, a portion of the conductive layer 160 may beremoved to form the gates 165. The gates 165 may be disposed in therecessed regions 126 and may be separated from each other. For example,the conductive layer 160 may be etched using a dry etching technique ora wet etching technique, thereby leaving the conductive layer 160 in therecessed regions 126. As a result, the gates 165 may be formed in therecessed regions 126. The conductive layer 160 may be formed of at leastone of various conductive materials. That is, the gates 165 may beformed of at least one of various conductive materials. The insulationlayer stack 150 formed outside the recessed regions 126 may be exposedafter formation of the gates 165.

Referring to FIG. 3H, the exposed insulation layer stack 150 may beselectively removed using a dry etching technique or a wet etchingtechnique. Sidewalls of the first sacrificial layers 111-115 may beexposed through the word line cuts 132 after removal of the exposedinsulation layer stack 150. As illustrated in FIGS. 4A and 4B, edges ofthe gates 165 may be formed to have a stepped shape when the mold stack103 is patterned to have a stepped shape.

Referring to FIG. 3I, the first sacrificial layers 111-115 may beselectively removed. In an embodiment, when the first sacrificial layers111-115 are formed of a silicon germanium (SiGe) layer, the firstsacrificial layers 111-115 may be selectively removed by supplying a wetetchant such as a hydrofluoric acid (HF) solution or a mixture of ahydrofluoric acid (HF) solution and a nitric acid (HNO₃) solutionthrough the word line cuts 132. Thus, air gaps 116 may be formed betweenthe gates 165. As a result, a gate stack 104 may be formed on thesubstrate 101. The gate stack 104 may include the vertical channels 140and the gates 165 vertically separated from each other by the air gaps116 along the respective vertical channels 140. Since the air has adielectric constant of about 1, the parasitic capacitance between thegates 165 may be minimized.

The gates 165 may include at least one string selection gate 165 s, atleast one ground selection gate 165 g, and a plurality of memory gates165 w. Each of the string selection gate 165 s and the ground selectiongate 165 g may constitute a non-memory transistor together with thecorresponding vertical channel 140 and the corresponding data storagelayer 155. Each of the memory gates 165 w may constitute a memorytransistor together with the corresponding vertical channel 140 and thecorresponding data storage layer 155. The non-memory transistors and thememory transistors that are vertically stacked along one verticalchannel 140, may constitute a single cell string 105. That is, the cellstring 105 may include one of the vertical channels 140 and theselection gates 165 s and 165 g and the memory gates 165 w verticallystacked along the vertical channel 140

Referring to FIG. 3J, an insulation layer 172 may be formed on thesubstrate having the air gaps 116. The insulation layer 172 may beformed to fill the word line cuts 132 but not to fill the air gaps 116.In an embodiment, the insulation layer 172 may be formed of, e.g., anoxide layer such as a silicon oxide layer using a chemical vapordeposition (CVD) technique. The insulation layer 172 may be formed tohave a void 172 a in each of the word line cuts 132. In other words, theinsulation layer 172 may exhibit poor step coverage such that the voids,e.g., the voids 172 a, are formed therein. The voids 172 a may be formedto reach the air gaps 116 adjacent thereto. In the event that the voids172 a are formed, the parasitic capacitance between the gates 165horizontally adjacent to each other may also be reduced. The insulationlayer 172 may close off, e.g., seal the word line cuts 132, and the airgaps 116 adjacent to the word line cuts 132.

The insulation layer 172 may be planarized until the vertical channels140 are exposed. The planarization of the insulation layer 172 may beperformed using, e.g., a chemical mechanical polishing (CMP) process oran etch-back process. Alternatively, the planarization of the insulationlayer 172 may be omitted. As illustrated in FIG. 4C, the gates 165 maybe formed to have a stepped edge configuration. Thus, the edges of thegates 165 may act as pads 167 that provide areas to be in contact with,e.g., the contacts 180 of FIGS. 1A and 1B.

Subsequently, bit lines 145, e.g., as illustrated in FIG. 1A, andcontacts 180, e.g., as illustrated in of FIG. 1A, may be formed tocomplete the semiconductor memory device 1. The bit lines 145 may beformed to be electrically connected to the vertical channels 140, andthe contacts 180 may be formed to be in contact with the pads 167 of thegates 165.

Second Exemplary Method Embodiment

FIGS. 5A to 5F are vertical sectional views illustrating a method offabricating a semiconductor device according to another exemplaryembodiment. This embodiment is similar to the previous embodimentdescribed with reference to FIGS. 3A to 3J and FIGS. 4A to 4C. Thus,differences between the present embodiment and the previous embodimentwill be mainly described hereinafter.

Referring to FIG. 5A, a mold stack 103 a may be formed on a substrate101. The mold stack 103 a may be formed to include a first sacrificiallayer group 110, a second sacrificial layer group 120, and a cappinginsulation layer 171. The first sacrificial layer group 110, the secondsacrificial layer group 120, and the capping insulation layer 171 may beformed of material layers having a relatively high wet etchingselectivity with respect to each other. However, the first sacrificiallayer group 110, the second sacrificial layer group 120, and the cappinginsulation layer 171 may have a relatively low dry etching selectivityor no dry etching selectivity with respect to each other. The firstsacrificial layer group 110 may include first sacrificial layers111-114, and the second sacrificial layer group 120 may include secondsacrificial layers 121-124. The mold stack 103 a may be formed byalternately stacking the first sacrificial layers 111-114 and the secondsacrificial layers 121-124. Thereafter, the capping insulation layer 171may be stacked on the topmost layer of the first sacrificial layers111-114 and the second sacrificial layers 121-124.

In an embodiment, the first sacrificial layers 111-114 may be formed ofa silicon germanium (SiGe) layer, and the second sacrificial layers121-124 may be formed of a silicon nitride (SiN or Si₃N₄) layer. Thecapping insulation layer 171 may be formed of a silicon oxide (SiO₂)layer. The capping insulation layer 171 may be formed as a topmost layerof the mold stack 103 a, as mentioned above. The mold stack 103 a may bepatterned to form vertical channel holes 130 penetrating the mold stack103 a and exposing the substrate 101. The vertical channel holes 130 maybe formed using a dry etching technique or a laser drilling technique.Vertical channels 140 may be formed in the vertical channel holes 130,respectively. The vertical channels 140 may be formed of a semiconductormaterial layer such as a silicon layer using, e.g., a depositiontechnique or an epitaxial growth technique. The vertical channels 140may be formed to fill the vertical channel holes 130 and to contact thesubstrate 101. The mold stack 103 a may be then patterned to form wordline cuts 132 between the vertical channels 140.

Referring to FIG. 5B, the second sacrificial layers 121-124 may beselectively removed using a wet etchant such as a phosphoric acid(H₃PO₄) solution. The wet etchant may be supplied through the word linecuts 132. As a result, recessed regions 126 may be formed between thefirst sacrificial layers 111-114. Further, the recessed regions 126 mayalso be formed between the topmost first sacrificial layer 114 and thecapping insulation layer 171. Thus, the recessed regions 126 may exposesidewalls of the vertical channels 140. That is, the first sacrificiallayers 111-114 and the capping insulation layer 171 may be verticallyseparated along the respective vertical channels 140 by the wet etchingprocess.

Referring to FIG. 5C, a data storage layer 155 and a gate 165 may beformed in each of the recessed regions 126. The data storage layer 155may be formed by sequentially stacking a silicon oxide layer, a siliconnitride layer, and a silicon oxide layer. Alternatively, the datastorage layer 155 may be formed by sequentially stacking a silicon oxidelayer, a silicon nitride layer, and an aluminum oxide layer. The gate165 may be formed by depositing a conductive layer such as a metal layeror a polysilicon layer and by selectively removing the conductive layerin the word line cuts 132.

Referring to FIG. 5D, the first sacrificial layers 111-114 may beselectively removed by, e.g., supplying a hydrofluoric acid solution ora mixture of a hydrofluoric acid (HF) solution and a nitric acid (HNO₃)solution through the word line cuts 132. Thus, air gaps 116 may beformed between the gates 165. As a result, a gate stack 104 a may beformed on the substrate 101. The gate stack 104 a may include the gates165 vertically separated along the respective vertical channels 140 bythe air gaps 116. The gate stack 104 a may also include the cappinginsulation layer 171 on the topmost gate, e.g., on a string selectiongate 165 s.

The gates 165 may include at least one string selection gate 165 s, aplurality of memory gates 165 w, and at least one ground selection gate165 g. Each of the string selection gate 165 s and the ground selectiongate 165 g may constitute a non-memory transistor together with thecorresponding vertical channel 140 and the corresponding data storagelayer 155. Each of the memory gates 165 w may constitute a memorytransistor together with the corresponding vertical channel 140 and thecorresponding data storage layer 155. The non-memory transistors and thememory transistors that are vertically stacked along one verticalchannel 140 may constitute a single cell string 105.

Referring to FIG. 5E, an insulation layer 173 may be formed on thesubstrate 101 having the air gaps 116. The insulation layer 173 may beformed of, e.g., at least one of a silicon oxide layer or a siliconnitride layer. The insulation layer 173 may be formed by using, e.g., aPVD technique or a CVD technique. The insulation layer 173 may be formedto exhibit a poor step coverage characteristic. That is, the insulationlayer 173 may be formed to have overhangs 174 above the word line cuts132. The overhangs 174 of the insulation layer 173 may be formed, e.g.,easily formed, in the event that the capping insulation layer 171 isformed as a topmost layer of the gate stack 104 a or the respective wordline cuts 132 has a relatively high aspect ratio. If the insulationlayer 173 is formed to have the overhangs 174 as described above, theword line cuts 132 may be hardly filled with the insulation layer 173.For example, adjacent overhangs 174 may contact each other so as to,e.g., reduce the possibility of the insulating layer 173 filling theword line cuts 132.

Referring the FIG. 5F, the insulation layers 171 and 173 may beplanarized until top surfaces of the vertical channels 140 are exposed.As such, an insulation layer 175 that closes upper openings of the wordline cuts 132, e.g., overlaps the openings so as to substantiallycompletely cover the word line cuts 132. The insulation layer 175 mayseal the word line cuts 132 and the air gaps 116 adjacent to the wordline cuts 132. The word line cuts 132 closed off by the insulation layer175 may have therein unfilled spaced, e.g., the unfilled spaces mayinclude air therein. The unfilled spaces of the word line cuts 132 maybe continuous with the air gaps 116. Planarization of the insulationlayers 171 and 173 may be performed using, e.g., an etch-back process ora CMP technique.

According to an exemplary embodiment, a plurality of insulation layers175 may be formed to cover the vertical channels 140. Each insulationlayer 175 may extend between adjacent vertical channels 140 to cover theuppermost gate 165 and the word line cut 132, e.g., as illustrated inFIG. 5F. The gates 165 may be insulated from each other by the air gaps116, and the upper openings of the word line cuts 132 may be closed,e.g., sealed, by the insulation layer 175. Thus, the word line cuts 132may be filled with the air, e.g., like the empty spaces between thegates 165 vertically stacked. Further, each of the gates 165 may beformed to have an edge serving as a word line pad 167, as illustrated inFIG. 4C.

Third Exemplary Method Embodiment

FIGS. 6A to 6F illustrate vertical sectional views in stages of a methodof fabricating a semiconductor device according to another exemplaryembodiment. In the following embodiment, differences between the presentembodiment and the first method embodiment illustrated in FIGS. 3A to 3Jand FIGS. 4A to 4C will be mainly described hereinafter.

Referring to FIG. 6A, a mold stack 203 may be formed on a substrate 201.The mold stack 203 may be formed to include a first sacrificial layergroup 210 and a second sacrificial layer group 220. The firstsacrificial layer group 210 and the second sacrificial layer group 220may be formed of material layers having a relatively high wet etchingselectivity with respect to each other, and the first sacrificial layergroup 210 and the second sacrificial layer group 220 may have arelatively low dry etching selectivity or no dry etching selectivitywith respect to each other. The first sacrificial layer group 210 mayinclude first sacrificial layers 211-215. The second sacrificial layergroup 220 may include second sacrificial layers 221-224. The mold stack203 may be formed by alternately stacking the first sacrificial layers211-215 and the second sacrificial layers 221-224. In an embodiment, thefirst sacrificial layers 211-215 may be formed of a silicon germanium(SiGe) layer, and the second sacrificial layers 221-224 may be formed ofa silicon nitride (SiN or Si₃N₄) layer.

The mold stack 203 may be patterned to form vertical channel holes 230penetrating the mold stack 203 and exposing sidewalls of the firstsacrificial layers 211-215. The exposed sidewalls of the firstsacrificial layers 211-215 may be oxidized to form a protection layer218. According to an exemplary embodiment, if the first sacrificiallayers 211-215 are formed of the silicon germanium (SiGe) layer, theprotection layer 218 may be a silicon germanium oxide (SiGeOx) layer.

Referring to FIG. 6B, vertical channels 240 may be formed in thevertical channel holes 230, respectively. The vertical channels 240 maybe formed to fill the vertical channel holes 230 and to contact thesubstrate 201. The vertical channels 240 may be formed of, e.g., asemiconductor layer. The mold stack 203 may be then patterned using adry etching technique, thereby forming word line cuts 132 between thevertical channels 240. The word line cuts 232 may expose the substrate201. The word line cuts 232 may be formed to have, e.g., a trench shapeand to extend in the x-axis direction as illustrated in FIG. 1B.

Referring to FIG. 6C, the second sacrificial layers 221-224 may beselectively removed using a wet etchant such as a phosphoric acid(H₃PO₄) solution. The wet etchant may be supplied through the word linecuts 232. As a result, recessed regions 226 may be formed between thefirst sacrificial layers 211-215. The recessed regions 226 may exposesidewalls of the vertical channels 240 between the first sacrificiallayers 211-215. That is, the first sacrificial layers 211-215 may bevertically separated along the respective vertical channels 240 by therecessed regions 226.

Referring to FIG. 6D, a data storage layer 255 and a gate 265 may beformed in each of the recessed regions 226. The data storage layer 255may be formed to have a multi-layered structure including a tunnelinginsulation layer 251, a trapping insulation layer 252 on the tunnelinginsulation layer 251, and a blocking insulation layer 253 on thetrapping insulation layer 252, e.g., as illustrated in FIG. 2B.According to an exemplary embodiment, the tunneling insulation layer 251may be formed of a silicon oxide layer, the trapping insulation layer252 may be formed of a silicon nitride layer, and the blockinginsulation layer 253 may be formed of a silicon oxide layer or analuminum oxide layer. The gates 265 may be formed by depositing aconductive layer such as a metal layer or a polysilicon layer and byselectively removing the conductive layer in the word line cuts 232.

Referring to FIG. 6E, the first sacrificial layers 211-215 may beselectively removed by supplying, e.g., a hydrofluoric acid (HF)solution or a mixture of a hydrofluoric acid (HF) solution and a nitricacid (HNO₃) solution through the word line cuts 232. Thus, air gaps 216may be formed between the gates 265. As a result, a gate stack 204 maybe formed on the substrate 201. The gate stack 204 may include the gates265 vertically separated along the respective vertical channels 240 bythe air gaps 216.

The gates 265 may include at least one string selection gate 265 s, aplurality of memory gates 265 w, and at least one ground selection gate265 g. Each of the string selection gate 265 s and the ground selectiongate 165 g may constitute a non-memory transistor together with thecorresponding vertical channel 240 and the corresponding data storagelayer 255. Each of the memory gates 265 w may constitute a memorytransistor together with the corresponding vertical channel 240 and thecorresponding data storage layer 255. The non-memory transistors and thememory transistors, which may be vertically stacked along each verticalchannel 240, may constitute a single cell string 205.

When the first sacrificial layers 211-215 are selectively removed by thewet etching process, sidewalls of the vertical channels 240 may bedamaged by the wet etchant. However, according to an exemplaryembodiment, the protection layers 218 may reduce the possibility ofand/or prevent the sidewalls of the vertical channels 240 from beingdamaged by the wet etchant during the wet etching process.

Referring to FIG. 6F, an insulation layer 272 may be formed on thesubstrate having the air gaps 216. In an embodiment, the insulationlayer 272 may be formed of a silicon oxide layer using, e.g., a PVDtechnique or a CVD technique. The insulation layer 272 may be formedsuch that the insulation layer 272 may exhibit a poor step coveragecharacteristic. For example, the word line cuts 232 may not becompletely filled with the insulation layer 272. Thus, the insulationlayer 272 may be formed to have a void 272 a in each of the word linecuts 232. The insulation layer 272 may be planarized using an etch-backprocess or a CMP technique until top surfaces of the vertical channels240 are exposed. Alternatively, the insulation layer 272 may be formedto cover the vertical channels 240.

Fourth Exemplary Method Embodiment

FIGS. 7A to 7D illustrate vertical sectional views of stages in a methodof fabricating a semiconductor device according to still anotherexemplary embodiment. This embodiment is similar to the previousembodiment described with reference to FIGS. 6A to 6F. Thus, differencesbetween the present embodiment and the previous embodiment illustratedin FIGS. 6A to 6F will be mainly described hereinafter.

Referring to FIG. 7A, a mold stack 203 a may be formed on a substrate201. The mold stack 203 a may be formed to include a first sacrificiallayer group 210, a second sacrificial layer group 220 and a cappinginsulation layer 271. The first sacrificial layer group 210, the secondsacrificial layer group 220, and the capping insulation layer 271 may beformed of material layers having a relatively high wet etchingselectivity with respect to each other. The first sacrificial layergroup 210, the second sacrificial layer group 220, and the cappinginsulation layer 271 may have a relatively low dry etching selectivityor no dry etching selectivity with respect to each other. The firstsacrificial layer group 210 may include first sacrificial layers211-214. The second sacrificial layer group 220 may include secondsacrificial layers 221-224. The mold stack 203 a may be formed byalternately stacking the first sacrificial layers 211-214 and the secondsacrificial layers 221-224. The capping insulation layer 271 may bestacked as the topmost layer of the mold stack 203 a. According to anexemplary embodiment, the first sacrificial layers 211-214 may be formedof a silicon germanium (SiGe) layer, the second sacrificial layers221-224 may be formed of a silicon nitride (SiN or Si₃N₄) layer, and thecapping insulation layer 271 may be formed of a silicon oxide (SiO₂)layer.

The mold stack 203 a may be patterned to form vertical channel holes 230penetrating the mold stack 203 a and exposing the substrate 201. Thevertical channel holes 230 may also expose sidewalls of the firstsacrificial layers 211-214. The exposed sidewalls of the firstsacrificial layers 211-214 may be oxidized to form a protection layer218. In an exemplary embodiment, the protection layer 218 may be asilicon germanium oxide (SiGeOx) layer.

Referring to FIG. 7B, vertical channels 240 may be formed in thevertical channel holes 230, respectively. The vertical channels 240 maybe formed to fill the vertical channel holes 230 and to contact thesubstrate 201. The vertical channels 240 may be formed of, e.g., asemiconductor layer. The mold stack 203 a may be then patterned using adry etching technique, thereby forming word line cuts 232 between thevertical channels 240. The second sacrificial layers 221-224 may beselectively removed using a wet etchant such as a phosphoric acid(H₃PO₄) solution. The wet etchant may be supplied through the word linecuts 232. As a result, recessed regions 226 may be formed between thefirst sacrificial layers 211-214. Further, the recessed regions 226 mayalso be formed between the topmost first sacrificial layer 214 and thecapping insulation layer 271. Thus, the recessed regions 226 may exposesidewalls of the vertical channels 240.

Referring to FIG. 7C, a data storage layer 255 and a gate 265 may beformed in each of the recessed regions 226. The data storage layer 255may be formed by, e.g., sequentially stacking a silicon oxide layer, asilicon nitride layer, and a silicon oxide layer. Alternatively, thedata storage layer 255 may be formed by, e.g., sequentially stacking asilicon oxide layer, a silicon nitride layer, and an aluminum oxidelayer. The gate 265 may be formed by depositing a conductive layer suchas a metal layer or a polysilicon layer and by selectively removing theconductive layer in the word line cuts 232.

Referring to FIG. 7D, a gate stack 204 a may be formed on the substrate201. The gate stack 204 a may include the gates 265 which are verticallyseparated by air gaps 216 along the respective vertical channels 240.For example, the first sacrificial layers 211-214 may be selectivelyremoved by supplying a hydrofluoric acid (HF) solution or a mixture of ahydrofluoric acid (HF) solution and a nitric acid (HNO₃) solutionthrough the word line cuts 232. Thus, the air gaps 216 may be formedbetween the gates 265. The protection layers 218 may reduce thepossibility of and/or prevent sidewalls of the vertical channels 240from being damaged by the wet etchant during the wet etching process. Aninsulation layer 275 may be formed on the substrate 201 including theair gaps 216. The insulation layer 275 may be formed to close upperopenings of the word line cuts 232, e.g., to seal upper openings of theword line cuts 232 and to seal the air gaps 216. For example, using thesame manners as described with reference to FIGS. 5E and 5F, aninsulation layer, e.g., a silicon oxide layer or a silicon nitridelayer, may be formed on the gate stack 204 a including the air gaps 216.For example, the insulation layer may be formed to have overhangs. Theinsulation layer and the capping insulation layer 271 may be thenplanarized to form the insulation layer 275.

Fifth Exemplary Method Embodiment

FIGS. 8A to 8D are vertical sectional views illustrating a method offabricating a semiconductor device according to still yet anotherembodiment. In the following embodiment, differences between the presentembodiment and the first method embodiment illustrated in FIGS. 3A to 3Jand FIGS. 4A to 4C will be mainly described.

Referring to FIG. 8A, a first sacrificial layer group 310 and a secondsacrificial layer group 320 may be deposited on a substrate 301, therebyforming a mold stack 303. The first sacrificial layer group 310 mayinclude a plurality of first sacrificial layers 311-315 formed of asilicon germanium (SiGe) layer. The second sacrificial layer group 320may include a plurality of second sacrificial layers 321-324 formed of asilicon nitride (SiN or Si₃N₄) layer. According to the presentembodiment, distances between the first sacrificial layers 311-315 maybe less than distances between the first sacrificial layers 111-115,e.g., as illustrated in FIG. 3A. Thus, an overall height of the moldstack 303 may be reduced. Further, a height of recessed regions 326illustrated in FIG. 8C, which are to be formed by removing the secondsacrificial layers 321-324, may be reduced compared to other exemplaryembodiments. This may be clearly understood from FIG. 8C.

The mold stack 303 may be patterned to form vertical channel holes 330penetrating the mold stack 303 and exposing the substrate 301. The moldstack 303 may be patterned using, e.g., a dry etching technique or alaser drilling technique. A data storage layer 355 and a verticalchannel 340 may be formed in each of the vertical channel holes 330. Thedata storage layer 355 may vertically extend along the respectivevertical channels 340. Further, the data storage layer 355 may be formedto surround the respective vertical channels 340. The data storage layer355 may be formed by sequentially stacking a blocking insulation layer353, a trapping insulation layer 352, and a tunneling insulation layer351, e.g., as illustrated in FIG. 2C. Each of the vertical channels 340may be formed to have, e.g., a pillar shape surrounded by the datastorage layer 355. The vertical channels 340 may be formed to contactthe substrate 301.

Referring to FIG. 8B, the mold stack 303 may be patterned to form wordline cuts 332 between the vertical channels 340. The mold stack 303 maybe patterned using, e.g., a dry etching technique. The secondsacrificial layers 321-324 may be selectively removed by supplying a wetetchant such as a phosphoric acid (H₃PO₄) solution through the word linecuts 332. As a result, recessed regions 326 may be formed between thefirst sacrificial layers 311-315. The recessed regions 326 may exposethe data storage layers 355. The vertical channels 340 may be covered,e.g., the sidewalls of the vertical channels 340 may be entirely coveredwith the data storage layers 355, during the wet etching process forremoving the second sacrificial layers 321-324. Further, an outermostlayer of each of the data storage layers 355 may correspond to theblocking layer 353 formed of a silicon oxide layer or an aluminum oxidelayer. Thus, the vertical channels 340 as well as the blocking layers353 may not be damaged by the phosphoric acid (H₃PO₄) solution duringthe wet etching process.

Referring to FIG. 8C, gates 365 may be formed in the recessed regions326. For example, a metal layer such as a tungsten layer may be formedto fill the recessed regions 326 and the word line cuts 332. The metallayer in the word line cuts 332 may be selectively removed using, e.g.,a dry etching technique or a wet etching technique, to form the gates365 in the recessed regions 326. According to an exemplary embodiment,the data storage layers 355 may not be formed in the recessed regions326 between the first sacrificial layers 311-315. That is, a verticalheight of the respective recessed regions 326 may be reduced by twice athickness of the data storage layers 355 as compared with the aboveembodiments. For example, a vertical height of the mold stack 303 may bereduced to lower a total height of the semiconductor memory device.

Referring to FIG. 8D, a gate stack 304 may be formed on the substrate201. The gate stack 304 may include the gates 365 which are verticallyseparated by air gaps 316 along the respective vertical channels 340. Indetail, the first sacrificial layers 311-315 may be selectively removedby supplying a hydrofluoric acid (HF) solution or a mixture of ahydrofluoric acid (HF) solution and a nitric acid (HNO3) solutionthrough the word line cuts 332. Thus, the air gaps 316 may be formedbetween the gates 365 vertically stacked. The data storage layers 355may reduce the possibility of and/or prevent the vertical channels 340from being damaged by the wet etchant.

The gates 365 may include at least one string selection gate 365 s, aplurality of memory gates 365 w, and at least one ground selection gate365 g. Each of the string selection gate 365 s and the ground selectiongate 365 g may constitute a non-memory transistor together with thecorresponding vertical channel 340 and the corresponding data storagelayer 355. Each of the memory gates 365 w may constitute a memorytransistor together with the corresponding vertical channel 340 and thecorresponding data storage layer 355. The non-memory transistors and thememory transistors, which are vertically stacked along one verticalchannel 340, may constitute a single cell string 305.

An insulation layer 372 may be formed in the word line cuts 332. In anembodiment, the insulation layer 372 may be formed using a PVDtechnique. In an exemplary embodiment, the insulation layer 372 mayexhibit a poor step coverage characteristic. Thus, the insulation layer372 may not be formed in the air gaps 316. However, the insulation layer372 may partially fill the word line cuts 332. That is, the insulationlayer 372 may be formed to have a void 372 a in each of the word linecuts 332. The voids 372 a may be formed to have a large size. In thiscase, the voids 372 a may be connected to the air gaps 316 adjacentthereto.

Sixth Exemplary Method Embodiment

FIGS. 9A to 9D illustrate vertical sectional of stages in a method offabricating a semiconductor device according to a further exemplaryembodiment. This embodiment is similar to the previous embodimentdescribed with reference to FIGS. 8A to 8D. Thus, differences betweenthe present embodiment and the previous embodiment illustrated in FIGS.8A to 8D will be mainly described hereinafter.

Referring to FIG. 9A, a mold stack 303 a may be formed on a substrate301. The mold stack 303 a may be formed using similar stages asdescribed with reference to FIG. 5A. That is, the mold stack 303 a maybe formed to include a first sacrificial layer group 310, a secondsacrificial layer group 320, and a capping insulation layer 371. Thefirst sacrificial layer group 310 may be formed to include a pluralityof first sacrificial layers 311-314. The second sacrificial layer group320 may be formed to include a plurality of second sacrificial layers321-324.

The capping insulation layer 371 may be formed to act as a topmost layerof the mold stack 303 a. Further, the capping insulation layer 371 maybe formed of a material layer having a wet etching selectivity withrespect to the first and second sacrificial layer groups 310 and 320.For example, the capping insulation layer 371 may be formed of a siliconoxide layer. The mold stack 303 a may be patterned to form verticalchannel holes 330 penetrating the mold stack 303 a. A data storage layer355 and a vertical channel 340 may be formed in each of the verticalchannel holes 330. The data storage layer 355 may be formed by, e.g.,sequentially stacking a blocking insulation layer 353, a trappinginsulation layer 352, and a tunneling insulation layer 351, asillustrated in FIG. 2C.

Referring to FIG. 9B, the mold stack 303 a may be dry-etched to formword line cuts 332 between the vertical channels 340. The secondsacrificial layers 321-324 may be selectively etched by supplying a wetetchant such as a phosphoric acid (H₃PO₄) solution through the word linecuts 332. As a result, recessed regions 326 may be formed between thefirst sacrificial layers 311-314 which are vertically stacked.

Referring to FIG. 9C, gates 365 may be formed in the recessed regions326, respectively. For example, a metal layer may be formed to fill therecessed regions 326 and the word line cuts 332. The metal layer in theword line cuts 332 may be selectively removed to form the gates 365 inthe recessed regions 326.

Referring to FIG. 9D, a gate stack 304 a may be formed on the substrate301. The gate stack 304 may include the gates 365, which may bevertically separated by air gaps 316 along the respective verticalchannels 340. The first sacrificial layers 311-314 may be selectivelyremoved by, e.g., supplying a hydrofluoric acid (HF) solution or amixture of a hydrofluoric acid (HF) solution and a nitric acid (HNO₃)solution through the word line cuts 332. Thus, the air gaps 316 may beformed between the gates 365 that are vertically stacked. An insulationlayer 375 may be then formed on the substrate 301 including the air gaps316. The insulation layer 375 may be formed to close, e.g., seal, upperopenings of the word line cuts 332. For example, using the same mannersas described with reference to FIGS. 5E and 5F, an insulation layer suchas a silicon oxide layer or a silicon nitride layer may be formed tohave overhangs on the gate stack 304 a including the air gaps 316. Theinsulation layer and the capping insulation layer 371 may be planarizedto form the insulation layer 375.

Seventh Exemplary Method Embodiment

FIGS. 10A to 10D illustrate vertical sectional in stages of a method offabricating a semiconductor device according to a yet further exemplaryembodiment. This embodiment is similar to the previous embodimentdescribed with reference to FIGS. 8A to 8D. Thus, differences betweenthe present embodiment and the previous embodiment illustrated in FIGS.8A to 8D will be mainly described hereinafter.

Referring to FIG. 10A, a mold stack 303 b may be formed on a substrate301. The mold stack 303 b may be formed to include a first sacrificiallayer group 310 and a second sacrificial layer group 320. The firstsacrificial layer group 310 may include first sacrificial layers311-315. The second sacrificial layer group 320 may include secondsacrificial layers 321-324 that are disposed between the firstsacrificial layers 311-315, e.g., the first sacrificial layers 311-315and the second sacrificial layers 321-324 may be alternately stacked.

Vertical channel holes 330 may be formed to penetrate the mold stack 303b. A first data storage layer 355 a and a vertical channel 340 may beformed in each of the vertical channel holes 330. In an exemplaryembodiment, the first data storage layer 355 a may be formed to includea tunneling insulation layer that vertically extends along an inner wallof the vertical channel hole 340. In another embodiment, the first datastorage layer 355 a may be formed to include a blocking insulation layerand a tunneling insulation layer. In this case, the blocking insulationlayer may be formed to vertically extend along an inner wall of therespective vertical channel holes 340, and the tunneling insulationlayer may be formed to cover an inner sidewall of the blockinginsulation layer.

Referring to FIG. 10B, the mold stack 303 b may be patterned to formword line cuts 332 between the vertical channels 340. The secondsacrificial layers 321-324 may be selectively etched by supplying a wetetchant such as a phosphoric acid (H₃PO₄) solution through the word linecuts 332. As a result, recessed regions 326 may be formed between thefirst sacrificial layers 311-315. The recessed regions 326 may exposethe first data storage layers 355 a.

Referring to FIG. 10C, a second data storage layer 355 b and a gate 365may be formed in each of the recessed regions 326. In an exemplaryembodiment, when the first data storage layer 355 a include only atunneling insulation layer, the second data storage layer 355 b mayinclude a trapping insulation layer formed to cover inner walls of therespective recessed regions 326 and a blocking insulation layer formedto cover the trapping insulation layer. In another exemplary embodiment,when the first data storage layer 355 a include a tunneling insulationlayer and a trapping insulation layer, the second data storage layer 355b may include a blocking insulation layer formed to cover inner walls ofthe respective recessed regions 326. As a result, the first and seconddata storage layers 355 a and 355 b may be formed, as illustrate in FIG.2D. That is, the first data storage layer 355 a may be formed tovertically extend along the respective vertical channels 340, and thesecond data storage layer 355 b may be formed to cover inner walls ofthe respective recessed regions 326. The first and second data storagelayers 355 a and 355 b may constitute the data storage layer 355.

Referring to FIG. 10D, the first sacrificial layers 311-315 may beselectively etched by, e.g., supplying a hydrofluoric acid (HF) solutionor a mixture of a hydrofluoric acid (HF) solution and a nitric acid(HNO₃) solution through the word line cuts 332. Thus, air gaps 316 maybe formed between the gates 365 that are vertically stacked.

The gates 365 may include at least one string selection gate 365 s, aplurality of memory gates 365 w, and at least one ground selection gate365 g. Each of the string selection gate 365 s and the ground selectiongate 365 g may constitute a non-memory transistor together with thecorresponding vertical channel 340 and the corresponding data storagelayer 355. Each of the memory gates 365 w may constitute a memorytransistor together with the corresponding vertical channel 340 and thecorresponding data storage layer 355. The non-memory transistors and thememory transistors, which are vertically stacked along one verticalchannel 340, may constitute a single cell string 305. As a result, agate stack 304 b including the cell strings 305 may be formed on thesubstrate 301.

An insulation layer 372, e.g., a silicon oxide layer, may be formed tofill the word line cuts 332 on the substrate 301 having the cell strings305. The insulation layer 372 may exhibit a poor strep coveragecharacteristic. In this case, the insulation layer 372 may have a void372 a in each of the word line cuts 332.

Eighth Exemplary Method Embodiment

FIGS. 11A to 11C illustrate vertical sectional views of stages in amethod of fabricating a semiconductor device according to a stillfurther exemplary embodiment. This embodiment is similar to the previousembodiment described with reference to FIGS. 10A to 10D. Thus,differences between the present embodiment and the previous embodimentillustrated in FIGS. 10A to 10D will be mainly described hereinafter.

Referring to FIG. 11A, a mold stack 303 c may be formed on a substrate301. The mold stack 303 c may be formed using the same manners asdescribed with reference to FIG. 9A. That is, the mold stack 303 c maybe formed to include a capping insulation layer 371 acting as a topmostlayer of the mold stack 303 c. Vertical channel holes 330 penetratingthe mold stack 303 c may be formed using the same manners as illustratedin FIG. 10A. A first data storage layer 355 a and a vertical channel 340may be formed in each of the vertical channel holes 330.

Referring to FIG. 11B, word line cuts 332, recessed regions 325, seconddata storage layers 355 b, and gates 365 may be formed using the sameand/or substantially the same stages as described with reference toFIGS. 10B and 10C. The first and second data storage layers 355 a and355 b may constitute a data storage layer 355.

Referring to FIG. 11C, the first sacrificial layers 311-314 may beselectively wet-etched to form air gaps 316 using the same manners asillustrated in FIG. 10D. The gates 365 may include at least one stringselection gate 365 s, a plurality of memory gates 365 w, and at leastone ground selection gate 365 g. Each of the string selection gate 365 sand the ground selection gate 365 g may constitute a non-memorytransistor together with the corresponding vertical channel 340 and thecorresponding data storage layer 355. Each of the memory gates 365 w mayconstitute a memory transistor together with the corresponding verticalchannel 340 and the corresponding data storage layer 355. The non-memorytransistors and the memory transistors, which are vertically stackedalong one vertical channel 340, may constitute a single cell string 305.As a result, a gate stack 304 c including the cell strings 305 may beformed on the substrate 301.

An insulation layer 375 may be formed on the substrate 301 having thestrings 305. The insulation layer 375 may be formed to have such that itcloses, e.g., seals, upper openings of the word line cuts 332, e.g., asillustrated in FIG. 5E.

Ninth Exemplary Method Embodiment

FIGS. 12A to 12D illustrate vertical sectional views of stages in amethod of fabricating a semiconductor device according to a still yetfurther exemplary embodiment.

Referring to FIG. 12A, a gate stack 304 may be formed on a substrate301. The gate stack 304 may be formed using the same and/orsubstantially the same stages as described with reference to FIGS. 8A to8D. In this case, a protection layer 318 may be additionally formed tocover data storage layers 255 that are exposed by air gaps 316. Theprotection layer 318 may be formed using the same manners as illustratedin FIG. 6A. For example, vertical channel holes 330 may be formed usingthe same and/or substantially the same stages as illustrated in FIG. 8A.Sidewalls of the first sacrificial layers 311-315 exposed by thevertical channel holes 330 may be oxidized to form the protection layer318, e.g., as described with reference to FIG. 6A. The protection layer318 may reduce the possibility of and/or prevent vertical channels 340and data storage layers 355 formed in the vertical channel holes 330from being damaged during a wet etching process for removing the firstsacrificial layers.

Referring to FIG. 12B, in the event that a gate stack 304 a is formedusing the same and/or substantially the same stages as described withreference to FIGS. 9A to 9D, the protection layer 318 covering datastorage layers 355 exposed by air gaps 316 between the gates 365 may beadditionally formed. The protection layer 318 may be formed using thesame and/or substantially the same stages as described with reference toFIG. 7A. Further, an insulation layer 375 may be formed to overlap theword line cuts 332. The insulation layer 375 may extend between twoadjacent vertical channels 340.

Referring to FIG. 12C, in the event that a gate stack 304 b is formedusing the same and/or substantially the same stages as described withreference to FIGS. 10A to 10D, the protection layer 318 covering firstdata storage layers 355 a exposed by air gaps 316 between the gates 365may be additionally formed. The protection layer 318 may be formed usingthe same and/or substantially the same stages as described withreference to FIG. 6A. An insulation layer 372 may be formed in the wordline cuts 332. In an embodiment, the insulation layer 372 may be formedusing a PVD technique. In an exemplary embodiment, the insulation layer372 may exhibit a poor step coverage characteristic. The insulationlayer 372 may be formed to have a void 372 a in each of the word linecuts 332.

Referring to FIG. 12D, in the event that a gate stack 304 c is formedusing the same and/or substantially the same stages as described withreference to FIGS. 11A to 11C, the protection layer 318 covering datastorage layers 355 exposed by air gaps 316 between the gates 365 may beadditionally formed. The protection layer 318 may be formed using thesame and/or substantially the same stages as described with reference toFIG. 7A.

Exemplary Application Embodiments

FIGS. 13A and 13B illustrate block diagrams of electronic productsincluding a semiconductor device according to an exemplary embodiment.

Referring to FIG. 13A, a memory card 1200 may include a flash memorydevice 1210, e.g., to provide a high capacity of data storage ability.The flash memory device 1210 may include at least one of thesemiconductor memory devices according to exemplary embodiments. Forexample, the flash memory device 1210 may include a vertical NAND-typeflash memory device.

The memory card 1200 may include a memory controller 1220 that maycontrol data communication between a host 1230 and the flash memorydevice 1210. The memory card 1200 may include a static random accessmemory (SRAM) device 1221 and a central processing unit (CPU) 1222. TheSRAM device 1221 may be used as an operation memory of the CPU 1222. Thememory controller 1220 may further include a host interface unit 1223.The host interface unit 1223 may be configured to include a datacommunication protocol. The memory controller 1220 may further includean error check and correction (ECC) block 1224. The ECC block 1224 maydetect and correct errors of data which are read out from the flashmemory device 1210. The memory controller 1220 may further include amemory interface unit 1225. The memory interface unit 1225 may controlthe communication between the memory controller 1220 and the flashmemory device 1210. The central processing unit (CPU) 1222 may controloverall operations of the memory controller 1220. Even though not shownin the drawings, the memory card 1200 may further include a read onlymemory (ROM) device that stores code data to interface with the host1230.

Referring to FIG. 13B, an information processing system 1330 accordingto exemplary embodiments may include at least one of the semiconductormemory devices described in the above exemplary embodiments. Forexample, the information processing system 1330 may include a flashmemory system 1310 having a vertical NAND-type flash memory deviceaccording to an exemplary embodiment. The information processing system1330 may include a mobile system, a computer or the like.

In an embodiment, the information processing system 1330 may include amodulator-demodulator (MODEM) 1320, a central processing unit (CPU)1330, a random access memory (RAM) device 1340, and a user interfaceunit 1350 that communicate with each other through a data bus 1360. Thedata bus 1360 may correspond to a path through which electrical signalsare transmitted. The flash memory system 1310 may include a flash memorydevice 1311 and a memory controller 1312. The memory controller 1312 maycontrol overall operations of the flash memory device 1311, and theflash memory device 1311 may store data processed by the CPU 1330 ordata transmitted from external system. The information processing system1330 may be applicable to a memory card, a solid state disk, a cameraimage sensor, or an application chipset. In particular, the flash memorysystem 1310 may include the solid state disk. In this case, theinformation processing system 1330 may be stable and reliable since thesolid state disk may stably store large data.

According to the embodiments set forth above, gates vertically stackedmay be spaced apart and electrically insulated from each other by airgaps. Thus, parasitic capacitance between the gates may be significantlyreduced to enhance operation speed of a semiconductor memory device. Inaddition, a protection layer may be formed to cover sidewalls ofvertical channels. Thus, the protection layer may reduce the possibilityof and/or prevent the vertical channels from being damaged by asubsequent etching process. As a result, the protection layer may leadto an improvement of yield. Moreover, memory cells of the semiconductormemory devices according to the above embodiments may be arranged in athree dimensional array to increase an integration density of thesemiconductor memory devices. That is, highly integrated semiconductormemory devices may be realized.

By way of summation and review, semiconductor devices are beingcontinuously scaled down. The integration density of two dimensionalsemiconductor devices, e.g., planar semiconductor devices may be mainlydetermined by a planar area that a unit memory cell occupies.Accordingly, the integration density of the two dimensionalsemiconductor devices may be affected by, e.g., a technology for formingfine and small patterns. However, realizing fine patterns in twodimensional semiconductor devices may result in increasing manufacturingcosts and/or high priced apparatuses. Therefore, there may be somelimitations in increasing the integration density of the two dimensionalsemiconductor devices. Therefore, three dimensional semiconductordevices including memory cells arranged in a three dimensional arrayhave been proposed to overcome the above limitations.

Example embodiments have been disclosed herein, and although specificterms are employed, they are used and are to be interpreted in a genericand descriptive sense only and not for purpose of limitation. In someinstances, as would be apparent to one of ordinary skill in the art asof the filing of the present application, features, characteristics,and/or elements described in connection with a particular embodiment maybe used singly or in combination with features, characteristics, and/orelements described in connection with other embodiments unless otherwisespecifically indicated. Accordingly, it will be understood by those ofskill in the art that various changes in form and details may be madewithout departing from the spirit and scope of the present invention asset forth in the following claims.

What is claimed is:
 1. A semiconductor memory device, comprising: aplurality of bit lines on a substrate and spaced apart from each otherin a first direction, the bit lines extending in a second direction thatintersects the first direction; a string selection line between thesubstrate and the bit lines, the string selection line extending in thefirst direction; a plurality of word lines between the substrate and thestring selection line, the word lines extending in the first direction;a plurality of vertical channels connected to the bit lines andsurrounded by the word lines and the string selection line, the verticalchannels extending in a third direction being substantiallyperpendicular to a surface of the substrate; a plurality of data storagelayers between the word lines and the vertical channels; and a word linecut between the plurality of vertical channels, the word line cutpenetrating the string selection line and the plurality of word lines,the word line cut extending in the first direction, wherein the wordline cut includes a void, and wherein an upper surface of the void ispositioned at a higher level than a lower surface of the stringselection line.
 2. The device as claimed in claim 1, wherein: the wordlines are separated from each other by air gaps therebetween in thethird direction, and the semiconductor memory device further comprises aprotection layer covering sidewalls of the vertical channels adjacent tothe air gaps.
 3. The device as claimed in claim 2, wherein theprotection layer includes an oxide layer of a silicon germanium.
 4. Thedevice as claimed in claim 1, further comprising an insulation layercovering an upper portion of the word line cut to close the word linecut, the insulation layer being in the word line cut and having the voidtherein, the insulation layer contacting the substrate or being spacedapart from the substrate by partially filling the upper portion of theword line cut.
 5. The device as claimed in claim 1, wherein the wordlines are separated from each other by air gaps therebetween in thethird direction, wherein the word line cut is between the plurality ofvertical channels, and wherein the word line cut includes a sidewallextending in the third direction, the sidewall of the word line cutbeing adjacent to the air gaps.
 6. The device as claimed in claim 1,wherein the word lines are separated from each other by air gapstherebetween in the third direction, and wherein the word lines and theair gaps are alternately disposed on the substrate in the thirddirection.
 7. The device as claimed in claim 1, wherein the word linesare separated from each other by air gaps therebetween in the thirddirection, and wherein the air gaps electrically insulate the word linesfrom each other.
 8. The device as claimed in claim 1, wherein the wordlines are separated from each other by air gaps therebetween in thethird direction, and wherein the air gaps have a dielectric constant ofabout
 1. 9. The device as claimed in claim 1, wherein each of theplurality of data storage layers includes at least one of a tunnelinginsulation layer, a trapping insulation layer, and a blocking insulationlayer.
 10. The device as claimed in claim 1, wherein the word lines areseparated from each other by air gaps therebetween, and wherein the voidof the word line cut is connected to at least one of the air gaps.
 11. Asemiconductor memory device, comprising: a string selection line on asubstrate and extending in a first direction; a plurality of word linesbetween the substrate and the string selection line, the word linesextending in the first direction; a plurality of channels surrounded bythe string selection line and the word lines, the channels extending ina second-direction being substantially perpendicular to the substrate; aplurality of data storage layers between the word lines and thechannels; and a word line cut between the plurality of verticalchannels, the word line cut penetrating the string selection line andthe plurality of word lines, the word line cut extending in the firstdirection, wherein the word line cut includes a void, and wherein anupper surface of the void is positioned at a higher level than a lowersurface of the string selection line.
 12. The device as claimed in claim11, wherein the word lines are separated from each other by air gapstherebetween in the third direction, and wherein the data storage layersextend along sidewalls of the channels, the data storage layersincluding first portions between the word lines and the channels andsecond portions exposed to the air gaps.
 13. The device as claimed inclaim 11, further comprising an insulating layer in the word line cutand including the void therein, the insulation layer contacting thesubstrate.
 14. The device as claimed in claim 11, further comprising aninsulating layer covering an upper portion of the word line cut to closethe word line cut, the insulating layer partially filling the word linecut to be spaced apart from the substrate, wherein the word lines areseparated from each other by air gaps therebetween in the thirddirection, and wherein the air gaps are partially connected to the voidof the word line cut.
 15. The device as claimed in claim 10, furthercomprising protection layers on sidewalls of the channels, theprotection layers being arranged along the sidewalls of the channels.16. The device as claimed in claim 15, wherein the data storage layersextend along the sidewalls of the channels and are interposed betweenthe channels and the protection layers.
 17. A semiconductor memorydevice, comprising: a plurality of bit lines on a substrate and spacedapart from each other in a first direction, the bit lines extending in asecond direction that intersects the first direction; a string selectionline between the bit lines and the substrate, the string selection lineextending in the first direction; a plurality of word lines between thesubstrate and the string selection line, the word lines extending in thefirst direction; a plurality of vertical channels connected to the bitlines and surrounded by the word lines and the string selection line,the vertical channels extending in a third direction being substantiallyperpendicular to a surface of the substrate; a plurality of data storagelayers between the word lines and the vertical channels; and a word linecut between the plurality of vertical channels, the word line cutpenetrating the string selection line and the plurality of word lines,the word line cut extending in the first direction, wherein the wordlines are separated from each other by air gaps therebetween, whereinthe word line cut includes a void, and wherein an upper surface of thevoid is positioned at a higher level than a lower surface of the stringselection line.
 18. The device as claimed in claim 17, furthercomprising an insulating layer disposed in the word line cut, theinsulating layer including the void.
 19. The device as claimed in claim17, the insulating layer covers an upper portion of the word line cut toclose the word line cut.
 20. The device as claimed in claim 17, whereinthe void of the word line cut is connected to at least one of the airgaps.